Advanced Electronics

The advanced electronics technologies encompassed by the Advanced Electronics COI include those that provide for the processing of information; detection of chemical, biological, radiological and nuclear threats; radio frequency (RF) sensing, transmission, communication; electro-optical/infrared (EO/IR) sensing, transmission, and communication; motion detection including assured references; and the underlying enabling technologies, among others.

Electronics Integration:  packaging and reliability
  • To create and explore new concepts, components and techniques for:
    • Planar and 3D integrated circuits
    • High power and dense packaging
    • Power electronics
    • Test
  • To overcome these technical challenges:
    • Heterogeneous integration with intimate integration of digital control and reconfiguration
    • Device design, fabrication, reliability and robustness for high voltages and high currents
    • Inability to exploit advances in wide bandgap semiconductor technologies with advanced dielectric and magnetic materials
    • Computational electronics or modeling and simulation
  • To gain the following operational opportunities:
    • Operation in harsh environments with superior thermal management for military systems
    • Higher performance for size, weight and power constrained platforms
    • Higher power density and efficiency at high voltages
Electronic Materials: synthesis and characterization
  • To create and explore new materials:
    • With tailored responses: metamaterials, multi-ferroics, oxides and phase-change materials
    • For infrared focal plane arrays, quantum optics, mmW RF photonics
    • For novel low power, high-speed devices for heterogeneous integration with silicon
    • For leading edge trusted silicon integrated circuits
    • For high-current, high-density cathodes
  • To overcome these technical challenges:
    • Lack of high quality growth techniques and characterization methods
    • Immature bottom-up and top-down assembly techniques for nanoelectronic materials
    • Inability to model and simulate materials under operational conditions over time
    • Computational Electronics
  • To gain the following operational opportunities:
    • Advanced sensing, electronic warfare, information technology, communication and imaging
EO/IR Components sensing, transmission and communication:
  • To create and explore new concepts, components and techniques for:
    • Advanced sensors, sources, and optical components for the generation, transmission and detection of ultraviolet, visible and infrared radiation
    • RF and mmW photonic devices and circuits
    • Electro-optical quantum components for sensors, information and computation
    • Advanced focal plane arrays- sensors and read-out integrated circuits
  • To overcome these technical challenges:
    • Inability to heterogeneously integrate disparate semiconductors - fabrication, reliability and robustness
    • Inability to model and simulate devices and circuits under operational conditions over time - Computational electronics
    • Inability to exploit advances in electronic materials
  • To gain these operational opportunities:
    • Improved sensing and signal processing for ISR, tracking and targeting, electronic warfare, information technology and communication systems
    • Advanced infrared countermeasures
    • Directed energy
Microelectronics and Nanoelectronics: mixed signal, digital processing and emerging architectures
  • To create and explore new concepts, components and techniques for:
    • Beyond silicon and Moore’s Law concepts for digital, high frequency and electro-optic devices
    • Quantum components for sensors, information and computation
    • Low-power, high-speed devices to heterogeneous integrate with silicon
    • Leading-edge, trusted silicon integrated circuits
    • Micro-electromechanical and micro-optoelectromechanical systems
    • More digital and cognitive apertures
    • Extreme miniaturization - higher functionality per unit volume
  • To overcome these technical challenges:
    • Limited availability of trusted, high-quality, affordable foundries and packaging houses
    • Inability to model and simulate materials under operational conditions over time - Computational Electronics
    • Inability to exploit advances in electronic materials and device models
  • To gain the following operational opportunities:
    • Advanced sensing, electronic warfare, information technology and communication systems
    • Improved device reliability and robustness
RF Components for sensing, transmission and communication:
  • To create and explore new concepts, components and techniques for:
    • Lightweight, miniature, efficient and affordable wide-bandwidth, high-linearity wide bandgap semiconductor devices / vacuum power electronics that cover frequencies from ~ 1 MHz to ~ 10 THz
    • Extremely low power devices for mixed signal integrated circuits
    • Advanced control components (filters, switches, etc.)
    • Advanced computational electromagnetic techniques and methods
    • Technologies that are reconfigurable and adaptive – both active and passive
  • To overcome these technical challenges:
    • Limited technologies for reconfigurability
    • Limited ability to meet extreme military operational requirements
    • Shortfalls in efficiency, thermal management and performance
    • Limited design tools, models and designs for bandwidth, efficiency and linearity goals
  • To gain these operational opportunities:
    • Next generation cognitive and adaptive sensors and countermeasures
    • Improved device reliability and robustness
    • Advanced electromagnetic sensor, communication, electronic warfare, imaging and directed energy (high power microwave) systems

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